BibTeX record journals/et/BackesMSWG12

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@article{DBLP:journals/et/BackesMSWG12,
  author       = {Benjamin Backes and
                  Colin McDonough and
                  Larry Smith and
                  Wei Wang and
                  Robert E. Geer},
  title        = {Effects of Copper Plasticity on the Induction of Stress in Silicon
                  from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits},
  journal      = {J. Electron. Test.},
  volume       = {28},
  number       = {1},
  pages        = {53--62},
  year         = {2012},
  url          = {https://doi.org/10.1007/s10836-011-5242-7},
  doi          = {10.1007/S10836-011-5242-7},
  timestamp    = {Sun, 06 Oct 2024 21:27:43 +0200},
  biburl       = {https://dblp.org/rec/journals/et/BackesMSWG12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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