BibTeX records: Yang Liu 0103

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@article{DBLP:journals/mr/ZhangLWFFSZ18,
  author       = {Hao Zhang and
                  Yang Liu and
                  Lingen Wang and
                  Jiajie Fan and
                  Xuejun Fan and
                  Fenglian Sun and
                  Guoqi Zhang},
  title        = {A new hermetic sealing method for ceramic package using nanosilver
                  sintering technology},
  journal      = {Microelectron. Reliab.},
  volume       = {81},
  pages        = {143--149},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2017.12.030},
  doi          = {10.1016/J.MICROREL.2017.12.030},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhangLWFFSZ18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/LiuSZXYZ15,
  author       = {Yang Liu and
                  Fenglian Sun and
                  Hao Zhang and
                  Tong Xin and
                  Cadmus A. Yuan and
                  Guoqi Zhang},
  title        = {Interfacial reaction and failure mode analysis of the solder joints
                  for flip-chip {LED} on {ENIG} and Cu-OSP surface finishes},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {8},
  pages        = {1234--1240},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2015.05.005},
  doi          = {10.1016/J.MICROREL.2015.05.005},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiuSZXYZ15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/ZhangLWS15,
  author       = {H. W. Zhang and
                  Yang Liu and
                  J. Wang and
                  F. L. Sun},
  title        = {Effect of elevated temperature on {PCB} responses and solder interconnect
                  reliability under vibration loading},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {11},
  pages        = {2391--2395},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2015.07.033},
  doi          = {10.1016/J.MICROREL.2015.07.033},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhangLWS15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/LiuLZWYZSL14,
  author       = {Yang Liu and
                  Stanley Y. Y. Leung and
                  Jia Zhao and
                  Cell K. Y. Wong and
                  Cadmus A. Yuan and
                  Guoqi Zhang and
                  Fenglian Sun and
                  Liangliang Luo},
  title        = {Thermal and mechanical effects of voids within flip chip soldering
                  in {LED} packages},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {9-10},
  pages        = {2028--2033},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.07.034},
  doi          = {10.1016/J.MICROREL.2014.07.034},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiuLZWYZSL14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/LiuSZWZ14,
  author       = {Yang Liu and
                  Fenglian Sun and
                  Hongwu Zhang and
                  J. Wang and
                  Zhen Zhou},
  title        = {Evaluating board level solder interconnects reliability using vibration
                  test methods},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {9-10},
  pages        = {2053--2057},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.07.058},
  doi          = {10.1016/J.MICROREL.2014.07.058},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiuSZWZ14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}